Electrical Engineering Division
Disciplines and Technologies

Flight Electronics Technologies

• Instrument Electronics Technologies
  • 1 Gs/sec digitizer
  • DSP target on PCI
  • Laser Programmable PGA

• Compression and Data Processing Technologies
  • Parallel and reconfigurable computing
• Parallel data path processor
• Flight qualified Reid Sollomon ASICS
• USES Loss-less compression chip
• DCS Lossy compression hardware
• Mongoose V
• Essential Services Node and JANUS
• PCI based hardware supporting instruments and Command and Data Handling
  • Flight qualified PCI ASIC
  • SMEX-Lite / Trianna R6000 computer board
  • High performance DSP on PCI bus

• Flight Network Technology Development
  • Fiber Optic Data Bus - 1 Gb/sec ring topology
  • MIL-STD-1355 network hardware
    • Twisted Pair copper network
    • 1-D, 2-D, 3-D Worm fabrics supported
    • PCI bus supported
• Communication Technologies
  • Phased Arrays
    • X-Band
    • Ka-Band
  • 4th Generation TDRS transponder
    • Possible X-Band exciter slice
    • Ka Band Upgrade
  • Advanced Receiver
  • Nanosat RF equipment
  • Passive Optical Communications
  • Bandwidth efficient modulation
  • Ka band wide bandwidth modulator

• Ultra Low Power Program

• Rad-Hard FPGA

• Radiation Test Method
  • Test methods and evaluations for new semiconductor processes
  • Test methods for new parts types
  • Methods for evaluating commercial and military parts
  • FPGA radiation testing

• Packaging Programmable digital substrates Stackable electronics